ACCESS was established in 2006 as a Sino-Israeli joint venture. ACCESS is the world leader in advanced organic coreless substrate technology and is the first company in the world to apply VIA POST technology in mass production of coreless substrates.With world leading VIA POST technology and the know-how of applying this technology in advanced, low cost coreless substrates production, ACCESS is fully equipped to satisfy the need for high density, high efficiency, high speed, low energy applications of today’s advanced packaging designs. The company currently possesses many patents in China, USA, South Korea, and Israel, with numerous patents under application across the world. ACCESS’ success in industrializing VIA POST technology in coreless substrate production has broken the monopoly of leading global IC substrate manufactures. 

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