Capital investment: USD120millions
Area: 70,000
Employees: 1350
Capacity: 300,000ft²/Month
Major product and technology
High mix low volume portfolio
Telecom/Computing/Networking card up to 18 layers 
Microvia Technology Process
Gold Finger process since 1990s
Soft gold plating for wire bonding
Hi-end RF & Microwave card i.e. cavity/coins/ partial hybrid
Heavy copper up to 4oz, selective thermal via plated over 70um
Automotive/Industry/Medical/Military multilayer card
Surface Finishes
Immersion Gold 
Gold Finger Plating   
Soft/hard Gold Plating
HASL(Lead Free)
Immersion silver with anti-tarnish

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